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Telecommunications

IJ Research has extensive experience manufacturing hermetic microelectronic housings and assemblies for fiber-optic, RF and laser applications. Our in-house processes include brazing, soldering and plating of materials including Tungsten Copper (WCu), Molybdenum Copper (MoCu), Kovar, Alloy 52 and other commonly used materials.

 

  • Fiber attachment to substrate
  • Fiber mount ceramics
  • Optoelectronic packages
  • Laser beam windows with built-in heaters